Aluminum Nitride Insulation Gold Plating

Ceramic PCBThe Ceramic PCB products are combined with the excellent heat dissipation performance of industrial ceramic and the characteristics of the metal conductor.The ceramic substrate and the metal film sintered into integrated circuit by using the technology o

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Ceramic PCB
The Ceramic PCB products are combined with the excellent heat dissipation performance of industrial ceramic and the characteristics of the metal conductor.The ceramic substrate and the metal film sintered into integrated circuit by using the technology of precision automation printing or vacuum coating on the high precision ceramic substrate.

Feature:
Stable input and output ;
High precision and low TCR;
Good heat dissipation performance;
Free of harmful substance and eco-friendly.

Application:
Communication base station circuit board
LED ceramic heat dissipation power module;
Ozone generator , vehicle sensor, solid-state relay ;
High -precision monolayer and multilayer circuit board;
Space industry and new energy industry core components.

Al2O3 Ceramic Circuit Technical Standard:
Test ItemsTechnical ParametersTest Conditions
Size and toleranceKeep in conformity with the technical drawingMicroscope
Warping degree1.Conectar≤0.2%  2.Monolithic≤0.05mmWarping admeasuring tool


Appearance Inspection
Defect CharacteristicsCriteriaTest Conditions
Fracture, stratification, scars and thru holeNot allowedVisual
Salient point, silver layer falls off, bumps, impurityProduct area≤0.2mm,Cross area≤ 0.1mm,other area≤0.3mm10 x microscope
DiscolorSilver Layer discolor:Not allowed, ceramic substrates:Light yellow allowedVisual
PollutionNot allowedVisual
Short-circuit between conductorLine distance >0.15mmMicroscope

Printing Layer/Coating Performance:
Test ItemsTechnical ParametersTest Conditions
Printing layer/Coating graphicKeep in conformity with the product drawing10 x microscope
Drying-out resistanceKeep in conformity with the product drawingHeating on heating board 300ºC/5min
Solder invasiveInvasive area≥95%260±5ºC/5±1 Sec immersion tin
Soldering resistanceUnilateral adhered tin 75μm260±5ºC/10±1 Sec immersion tin
TensionPrinting layer >20gfWelding plate crossed φ130μm Cu
AdhesionNot strippingTape cling to the surface with 3M#600, speed tear in the direction 90ºC after 30sec

Electrical Performance :
Test ItemsCriteriaTest Conditions
Short circuitNot allowedSwitch Testers
Open circuitNot allowedSwitch Testers

Reliability Testing:
Test ItemsTechnical ParametersTest Conditions
Red ink testNot penetrationRed ink boiling 100ºC/1Hr
Thermal shock testGood tightness and stratified, fall off and electrical performance is normal1.Temperature:-55ºC/125ºC 2.Min/2min 3.Switching time Max10s 4.Times:15

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