| Technical Capabilities | |||
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Max. Board size | 2000×610mm | ||
Min. board Thickness | 2-layer 0.15mm | ||
| 4-layer 0.4mm | |||
| 6-layer 0.6mm | |||
| 8-layer 1.5mm | |||
| 10-layer 1.6~2.0mm | |||
| Min. line Width/Space | 0.1mm(4mil) | ||
| Max. Copper thickness | 10OZ | ||
| Min. S/M Pitch | 0.1mm(4mil) | ||
| Min. hole size | 0.2mm(8mil) | ||
| Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||
| Hole dia. Tolerance | ,+0/-0.05mm(2mil) | ||
| Hole position deviation | ±0.05mm(2mil) | ||
| Outline tolerance | ±0.10mm(4mil) | ||
| Twist & Bent | 0.75% | ||
| Insulation Resistance | >10 12 Ω Normal | ||
| Electric strength | >1.3kv/mm | ||
| S/M abrasion | >6H | ||
| Thermal stress | 288°C 10Sec | ||
| Test Voltage | 50-300V | ||
| Min. blind/buried via | 0.15mm (6mil) | ||
Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
Materials | FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
High Quality PCB for Factory
Multilayer Six Sided printed circuit board
1. We have 10 years experience in Printed Circuit Board field to serve your needs
2. Competitive price with high quality service-24 hours online service
3. Prompt delivery reable factory
4. Our Printed Circuit Board get ISO and UL Certificates and meet ROHS standard
| NO | ITEM | Technical capabilities |
| 1 | Layers | 1-20 layers |
| 2 | Max. Board size | 2000×610mm |
| 3 | Min. board Thickness | 2-layer 0.25mm |
| 4-layer 0.6mm | ||
| 6-layer 0.8mm | ||
| 8-layer 1.5mm | ||
| 10-layer 1.6~2.0mm | ||
| 4 | Min. line Width/Space | 0.1mm(4mil) |
| 5 | Max. Copper thickness | 10OZ |
| 6 | Min. S/M Pitch | 0.15mm(4mil) |
| 7 | Min. hole size | 0.2mm(8mil) |
| 8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
| 9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
| 10 | Hole position deviation | ±0.05mm(2mil) |
| 11 | Outline tolerance | ±0.10mm(4mil) |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | >10 12 Ω Normal |
| 14 | Electric strength | >1.3kv/mm |
| 15 | S/M abrasion | >6H |
| 16 | Thermal stress | 288°C 10Sec |
| 17 | Test Voltage | 50-300V |
| 18 | Min. blind/buried via | 0.15mm (6mil) |
| 19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |